The content of this page reflects a large part of our standard processing, however there may be exceptions. Please contact us if further clarification is needed.
Providing products that are free of hazardous substances is NXP’s priority. NXP ® has a proactive environmentally preferred products program that works across the company. These activities are managed by the Environmental Compliance Organization (ECO) – Products team. The goal is to provide you with products that comply with regulatory and customer-defined restrictions on the use of such substances and minerals.
|Compliance Topic||Description||NXP Documents and Links|
|EU RoHS||The EU Restriction of the use of Hazardous Substances (RoHS) Directive 2002/95/EC took effect in 2006. Its replacement, Directive 2011/65/EU (RoHS-II) entered into force in 2011. RoHS applies to certain electrical & electronic equipment that are put on the market in EU member countries. RoHS may authorize continued use of lead where no feasible alternatives are available.||NXP RoHS Statement|
|China RoHS||China introduced a series of Management Methods in 2007 which are together known as China RoHS. The labeling regulation requires identification of electronic information product (EIP) that contains RoHS substances in excess of the allowable threshold.||NXP China RoHS|
|Regulation No 1907/2006 of the European Parliament and of the Council of 18 December 2006 on Registration, Evaluation, Authorization and Restriction of Chemicals entered into force on 1st June 2007. Substances are updated several times per year.||NXP REACH Statement|
|EU ELV||The EU End-of-Life Vehicle Directive, 2000/53/EC, restricts the presence of lead, cadmium, mercury, and hexavalent chromium in vehicles. ELV authorizes continued use of lead where no feasible alternatives are available.||NXP ELV Statement|
|EU WEEE||The EU Waste of Electrical and Electronic Equipment Directive, 2002/96/EC, seeks to minimize e-waste and maximize recycling or reuse of materials.||NXP Product Disposal|
|EU Packing Materials||The EU Parliament and Council Directive 94/62/EC of 20 December 1994 covers Packaging and Packaging Waste.||NXP Shipment Packaging|
|US Conflict Minerals||Section 1502 of the 2010 Dodd-Frank Wall Street Reform Act (US HR-4173) requires companies that must report to the SEC to determine if tin, tantalum, tungsten or gold (3T&G) are necessary to the functionality or production of a product manufactured by that company and, if so, to report annually whether the 3T&G directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo or an adjoining country.||NXP Conflict Minerals NXP CMRT v5.0 (Updated 05-12-17)|
|Ozone Depleting Substances (ODS)||US EPA regulations issued under sections 601-607 of the Clean Air Act phase out the production and import of ODS according to the Montreal Protocol.||NXP ODCS Statement|
|IMDS||The IMDS (International Material Data System) is the automobile industry's material data system. IMDS has become a global standard used by almost all the global OEMs. In the IMDS, all materials present in finished automobile manufacturing are collected, maintained, analyzed and archived. IMDS facilitates meeting the obligations placed on automobile manufacturers, and thus on their suppliers, by national and international standards, laws and regulations.||NXP IMDS Request|
|Industry Standard||Description||NXP Documents and Links|
|ISO14001||ISO-14001 is an ISO international standard dealing with environmental management system guidelines.||ISO14001|
|TS16949||TS16949 is an ISO technical specification incorporating various quality standards for suppliers to the automotive sector.||TS16949|
|OHSAS 18001||OHSAS 18001 gives requirements for an occupational health and safety (OH&S) management system, to enable an organisation to control its OH&S risks and improve its performance.||OHSAS 18001|
|ISO 9001||ISO 9001:2015 sets out the criteria for a quality management system. This standard is based on a number of quality management principles including a strong customer focus, the motivation and implication of top management, the process approach and continual improvement.||ISO 9001|
|JEDEC/IPC J-STD-020||J-STD-020 is the Joint Industry Standard of Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices. The Package Peak Temperature (PPT) must not be confused with the Solder Joint Reflow Temperature, the MSL/PPT Classification Profile is not for component board soldering in production lines.||
|UL94 Rating||UL94 is the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances. UL94 defines 12 classifications with a desired rating of V0 for semiconductor devices.||UL Certifications Directory|
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