This simple guide offers you answers to some of the most common questions about NXP's solutions. Many other aspects are covered within the rest of this website.
RoHS
Q. What is the NXP position on the “EU RoHS” and the “China RoHS”?
Read our “NXP Semiconductors RoHS Declaration” and explanatory statement on the “Chinese Administration on the Control of Pollution caused by Electronic Information Products (ACPEIP)”
Q. What is the meaning of the 
symbol?
EU/CN RoHS Compliant: NXP Semiconductors certifies that to the best of their knowledge these products are meeting the requirements of the European Union's Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive 2011/65/EU and can therefore be called EU RoHS compliant. These products have lead free terminations and no use has been made of an exemption under the EU RoHS directive. These products also meet the requirements of the Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products), the "China RoHS". NXP cannot warrant that products from NXP Semiconductors' customers, in which such NXP products are incorporated, will in turn comply with the European Union's Directive 2011/65/EU and/or with the Chinese ACPEIP.
Q. What is the meaning of the 
symbol?
EU RoHS Compliant: NXP Semiconductors certifies that to the best of their knowledge these products are meeting the requirements of the European Union's Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive 2011/65/EU and can therefore be called EU RoHS compliant. These products have lead free terminations but use has been made of an exemption under the EU RoHS directive. For example products with lead in high melting temperature solders used for die-attach or glass-diodes containing lead. NXP Semiconductors cannot warrant that products from NXP Semiconductors' customers, in which such NXP Semiconductor products are incorporated, will in turn comply with the European Union's Directive 2011/65/EU.
REACH
Q. What is the NXP position on “EU REACH”?
Read our “Explanatory statement on REACH provisions”.
Q. Are NXP Semiconductor products REACH compliant, and what about the used packaging materials?
NXP products (semiconductor devices, evaluation modules and used packaging materials) manufactured or sold by NXP Semiconductors do not contain any of the substances currently on the candidate lists of Substances of Very High concern (SVHC) published by ECHA. Furthermore, NXP products do not contain any of the substances above the maximum limits under the given application of Annex XVII of the REACH Regulation (EC) 1907/2006. Under these conditions our products are “REACH compliant.” When ECHA adds new substances to the candidate lists of SVHC, NXP will perform due diligence investigations to identify possible inclusions of SVHC in NXP products. Based upon the results of these investigations the explanatory statement on REACH provisions will be updated by NXP.
Lead-Free
Q. Why lead-free?
Environmental improvement (reduction or elimination of the potential hazardous effects from lead poisoning). NXP promotes lead-free manufacturing, which is mandated by legislation and supported by strong market demand.
Q. What is the definition of Pb-free?
Content less than 1000 ppm Pb by weight of homogeneous material. See more detailed info via RHF-indicator
Q. What is the meaning of the 
symbol?
This logo will be added to the barcode label if the product does not contain any Lead conform the Pb-free definition. The barcode-label is attached to both reel and box. Where possible the reel label is equal to the PQ label. When the label is too large for the reel, the PQ label is cut in two, with the bottom half placed on the front side of the reel and the top half on the rear side.
Q. Are lead-free NXP devices compatible with conventional (Sn/Pb solderpaste) soldering processes?
Yes. For many years our products have been suitable for the higher temperature profiles required by most lead-free soldering processes. Full forward / backward compatibility (exception is the BGA-family as conventional reflow temperatures are too low for melting SAC solder ball) is ensured because all lead-free devices have either pure tin or NiPdAu plating. As with any change it may be necessary to re-optimize the soldering processes.
Q. Does pure tin plating have any effect on external / internal dimensions, or mechanical and electrical behavior?
All dimensions and both mechanical and electrical behavior are unaffected. Also, no change in the distribution of electrical parameters has been detected.
Q. Do higher soldering temperatures have any negative impact on the moisture sensitivity level (MSL)?
For our small-signal discrete products there is no impact on the MSL. For ICs, in about 70% of cases there is no change while for the remaining 30% some change in MSL is likely. Please check out the individual package information for more detailed information.
Q. Do Pb-free products have any impact on shelf life?
No. Guaranteed shelf life remains the same as for current SnPb products.
Q. What are NXP Pb-free solutions?
- Pure tin (100% Sn)
- 100% Sn + post bake for packages such as QFP / PLCC
- NiPdAu for packages including SO / SSOP / TSSOP / HTSSOP / HVQFN
- SnAgCu for BGA-like packages
Q. Why is pure tin used?
Through many years experience NXP has found pure tin to be the proven, logical choice for coating package leads / terminals, enabling ideal drop-in replacements for devices using lead-alloy platings.
Q. What measures are taken by NXP to prevent whisker growth on products?
Along with thorough test procedures, the following measures are introduced into the production process:
- use of the appropriate lead frame material
- application of the proper chemicals
- lead frame pre-treatment prior to plating
- tightly controlled, minimum plating thickness
- post bake (not Discretes)
We have investigated whisker behavior of our products for more than two years and no serious whisker growth has been detected.
Halogen-Free
Q. Why Halogen-free?
Environmental improvement (reduction or elimination of the potential hazardous effects on the environment). The concern is with the end-of-life disposal of electronic products containing halogens, in particular, disposal through incineration as a recovery method to obtain the precious metals from electronic products. When incinerated dioxins and furans are released into the environment where they accumulate over a lifetime and persist for years. Exposure is likely to result in an increased risk of cancer. NXP, as a main supplier of semiconductor products to the electronics industry, is therefore promoting halogen-free manufacturing. Currently there is already a wide range of NXP halogen-free products available on the market.
Q. What is the definition of Halogen-free?
Content less than 900 ppm for Chlorine and Bromine Compounds combined by weight of homogeneous material. The halogens, Fluorine, Iodine and astatine are not in the scope. In addition, content is also less than 900ppm for Antimony Oxides by weight of homogeneous material. See more detailed info via RHF-indicator
Q. What is the meaning of the 
symbol?
This logo will be added to the barcode label if the product does not contain any Halogens conform the Halogen-Free definition. The barcode-label is attached to both reel and box. Where possible the Reel label is equal to the Product Quality label. When the label is too large for the reel, the PQ label is cut in two, with the bottom half placed on the front side of the reel and the top half on the rear side.
RHF-indicator
Q. What is the meaning of the RHF-indicator?
RHF = RoHS Halogen Free indicator. The RHF-2006 indicator has been introduced by NXP in order to identify compliancy to and will be used in the marking of commercial products and on their packing labels. RHF-2006 identification codes:
(Non-RoHS compliant) = All non-RoHS compliant products (regardless of being halogen/antimony-free). For example products with Lead in the outer terminals like QFP with traditional SnPb plating and BGA's with SnPb balls
(Exempted) = Products containing exempted Lead that do contain Halogens/Antimony. For example products with eutectic solder die-attach (HSOP/SIL-P) packages and glass-diodes containing Lead
(Green) = Products which fully comply to the EU Directive 2002/95/EC (RoHS)
(Halogen/Antimony-Free) = Products containing exempted Lead, but Halogen-Antimony-Free
(Dark-Green) = Products as G, but in addition free of Halogens/Antimony
Q. What is the definition of Green?
When a product is identified as G(reen), it implies to be RoHS compliant per below limits:
| Substances | Threshold Limit | |
| Lead | < 1000 ppm (0.1 %) | |
| Mercury, Chromium (VI), PBB's and PBDE's | < 1000 ppm (0.1 %) | |
| Cadmium | < 100 ppm (0.01%) |
Substances above are not intentionally added, but might be present as an impurity with an upper limit according to the listed values.
Threshold limits refer to the individual homogeneous materials (such as post-plating, adhesive, substrate, mould compounds etc.)
Q. What is the definition of Dark-Green?
When a product is identified as D(ark-Green), it implies to be RoHS compliant AND Halogen-Antimony-Free per below limits:
| Substances | Threshold Limit | |
| Antimony Oxides | < 900 ppm (0.09%)* | |
| Chlorinated + Brominated Compounds | Σ< 900 ppm (0.09%) |
*In Glass-diodes <1500ppm (0.15%)
Substances above are not intentionally added, but might be present as an impurity with an upper limit according to the listed values. Exception is made for Glass-diodes, where it has been intentionally added because of its critical application as a fining agent (or degasser) to reduce the amount of air-bubbles in the glass. Threshold limits refer to the individual homogeneous materials (such as post-plating, adhesive, substrate, mould compounds etc.).
Q. Where can I find the RHF-indicator?
The RHF-indicator can be found on the Quality pages as well as in the Chemical Content Datasheets. These are accessible via the search box in the right top corner of the NXP homepage. When searching for a specific product you can select “Chemical Content” and/or “Product Information”. For getting to the Quality pages please use the link provided on the Product Information pages and then click on the “Quality” tab.
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