NXP and High Performance Mixed Signal
Everyone has their own exact understanding of what is meant by ‘mixed signal’ - that combination of analog and digital circuitry that lies somewhere between Moore‘s Law and ‘More-than-Moore’. But what does NXP mean when it talks about High Performance Mixed Signal?
Our strong heritage of innovation in RF, Analog, Power Management, Interface, Security and Digital Processing gives NXP a unique portfolio of IP and fabrication processes, along with competitive front-end and volume back-end operations including a strong package innovation track record. Combining these with application insights and sub-system expertise enables us to create multiple solutions to engineering problems that deliver on functional performance, efficiency, robustness and versatility.
HPMS is about developing application optimized mixed-signal sub-system solutions and pursuing cost of ownership reductions for our customers through SiP and/or silicon level integration where this makes economic sense.
Deep technical expertise
Amongst NXP‘s capabilities are secure and low power DSP core designs for consumer and automotive applications. We are also one of the industry leaders in developing ARM-based processors and we are an innovation leader in embedded crypto-controllers.
From a fabrication process perspective, NXP‘s proprietary processes include RF (LDMOS and SiGe:C BiCMOS), mixed-signal (SOI ABCD smart power technology) and high-voltage (EZ-HV SOI high-voltage BCDMOS and TrenchMOS) technologies.