Digital still camera

Digital still camera

Enhancing the user experience, simplifying your design. Whatever your Digital Still camera design, you can rely on NXP Semiconductors for enhancing the user experience by improving GPS performance, enabling easy to use peer-to-peer communication, mobilizing multimedia and improving the audio experience. Our dedicated interface solutions and complete standard product portfolio is simplifying and shortening the design cycle and is backed by a secure and cost effective supply chain.

Block diagram

Key features and benefits

  • Innovative audio solutions
  • Advanced GPS LNAs
  • Highly integrated NFC and RFID front-ends deliver the best interoperability
  • Ultra low power logic solutions in smallest packages
  • Extensive EMI filter and ESD protection options
  • Comprehensive standard product portfolio

Whether it’s application specific solutions for peripheral functions - like advanced audio, NFC enabled peer-to-peer communication and tailored software – or simply the most extensive portfolio of standard products, you can rely on NXP Semiconductors.

Advanced audio
We provide you with affordable and easy to use audio solutions that deliver superior audio quality and reduce component count.

With our NFC / RFID solutions you enable interoperability at the touch of a button.

With Qubic 4 technolgy based GPS LNAs time to first fix is shorten significantly

Comprehensive standard product portfolio
NXP Semiconductors is a one-stop-shop for your standard components for camera, SIM and external memory interfaces. You will find the most complete range of standard products and global support.

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Over the last years, many advanced features such as GPS localization, wireless transmission and a large  range of audio and video enhancement possibilities have been added to the camera to enhance the user experience. In addition, image quality has improved drastically, and  there is more standardization for data storage and data transfer interfaces, such as memory cards, USB and HDMI.

Memory Card Interfaces

According the IEC61000-4-2 standard, SD host interfaces require additional high-level ESD protection, in addition to the integrated ESDprotection which is typically very weak. Other strict EMI regulations and system requirements, as specified in GSM mobile phones, strongly request filtersthat reduce the radiated/conducted EMI. However, they must still comply with the electrical requirements of the interface specification.

The continuing trend of miniaturization of portable appliances implies that interface devices offering ESD protection and EMI filtering should also integrate biasing circuits/resistors into a single small-sized package. NXP’s memory card interface solutions fully support this continuing trend and offer interface conditioning functions such as high-level ESD protection according the IEC61000-4-2 standard. They also support EMI filtering, integrated biasing resistor networks, regulated power supply to supply SD-memory cards directly from a battery, and voltage level translation to enable the use of low-voltage host processors to communicate with 2.7 V to 3.6 V compliant SD-memory card devices.


There is an increase in multiple RF frequency and RF system integration into portable appliances at the request of the consumers. The need for higher performance requires maximum sensitivity from receiver antennas without being disturbed by jammers and other disturbances from different RF systems. NXP’s LNA require an industry minimum in external components, while offering a top noise and jammer suppression performance.

Housed in an extremely small package, NXPs latest LNA requires only one external matching inductor and one external decoupling capacitor. It adapts itself to the changing environment in response to the presence of different radio systems. Read more …

Charger interface

Whether your device is charged via the USB port or a separate charger, it is exposed to incorrect polarity or abnormally high voltages. Any of these two occurrences poses a threat to the charger circuit and the PMU of the mobile device. In addition, the USB/charger port can be subject to ESD strikes and other transient discharges.

NXP offers an application specific portfolio of TVS diodes and ESD arrays, which enable cost efficient protection solutions - ESD, reverse polarity, overvoltage, other transient discharges – with the smallest footprint.


The impedance matched (100 ohm differential) TMDS lines are critical for the design of an HDMI interface, with minimal line capacitance to allow maximized EYE openings of the differential signals and robust system level ESD protection. The EYE open pattern test is actively supported by NXP, which is a founding member of the HDMI consortium. Our Authorized Test Center in Caen, France, offers HDMI compliance measurements including TDR and our development teams can assist with the more challenging aspects of HDMI, including HDCP keys.

Our low power HDMI transmitters connect to a 3 x 8 DVI and offer support for CEC and HDCP. It is backward compatible with DVI 1.0 and can be connected to any DVI 1.0 or HDMI sink. Our HMDI ESD protection saves mobile devices from ESD strikes and transient discharges when the HDMI cable is connected between source and sink devices such as TVs, mobile phones, media boxes and other sources.

Diode & Transistors

Documentation for this application

File nameTitleTypeFormatDate
AN10911SD(HC)-memory card and MMC interface conditioning (1.0)Application notepdf2010-04-29
AN10910Protecting charger interfaces and typical battery charging topologies with external bypass transistors (1.0)Application notepdf2010-04-29
75016889Small, efficient, and robust solutions for digital still cameras; NXP discretes for power management, interface, and general-purpose applications (1.0)Brochurepdf2010-04-01
NXP_Mobile_UsageIntergrated discretes, interface conditioning and interface protection in mobile appliances (8.0)Brochurepdf2010-07-02
75015768Robust serial link for mobile applications; NXP mobile interface link PTN3700 (1.0)Leafletpdf2006-10-01
7501679830 dB EMI filter with up to 30 kV IEC contact ESD protection in leadless packages; NXP multi-channel ESD protection and EMI filter IP425xCZ8-4/CZ12-6/CZ16-8 IP4256CZ3-M/CZ5-W/CZ6-F (1.0)Leafletpdf2009-09-01
75016799Low-power, high-speed, dual-supply voltage translation (0.8 to 5.5 V) (1.0)Selection guidepdf2009-09-01
75017090Application guide; Portable devices and mobile handsets (3.0)Selection guidepdf2011-08-15
tn_analog_digital_switchesFeatures and applications of switches (1.0)Technical notepdf2009-04-15

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