Mobile internet device / tablet

Mobile internet device / tablet

Whatever your mobile internet device, you can rely on NXP Semiconductors for innovative solutions for advanced audio, dedicated interface functions, and a complete standard product portfolio, backed by a secure and cost effective supply chain.

Block diagram

Key features and benefits

  • Innovative audio solutions
  • Highly integrated NFC and RFID front-ends deliver the best security and interoperability
  • Ultra low power logic solutions in smallest packages
  • Extensive EMI filter and ESD protection options
  • Comprehensive standard product portfolio

Whether it’s application specific solutions for peripheral functions - like advanced audio, secure services (NFC), or tailored software – or simply the most extensive portfolio of standard products, you can rely on NXP Semiconductors.

Advanced audio

We provide you with affordable and easy to use audio solutions that deliver superior sound quality and reduce component count. Highlights include our amplifiers with digital input, and our LifeVibes audio software.

Security and interoperability

For improved and secure on-the-go experiences for smart, feature and low-cost phones, we support NFC and RFID standards, with top performers such as the PN544 second-generation NFC controller. With our high level of integration you have guaranteed interoperability with existing infrastructure.

Comprehensive standard product portfolio

NXP Semiconductors is a one-stop-shop for your standard components for camera, SIM and external memory interfaces. You will find the most complete range of standard products and global support.

Compact and robust

If you want to save space with compact designs, choose our next-generation packaging. For example, our new chip-scale package (CSP) devices have an exceptionally compact footprint yet achieve a new benchmark in mechanical robustness.

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Mobile internet devices, such as tablets and PDAs, must be able to withstand long periods of use as users increasingly use them for mobile internet access, multimedia viewing, navigation, video conferencing, personal organizing and secure transactions. NXP enables all of the required functionality with the support of NFC and security technology. Our portfolio includes energy efficient audio solutions, enhanced GPS performance, ESD&EMI protection with the smallest footprint and a wide range of application specific interface solutions.


Near Field Communication (NFC) is the latest trend in mobile devices. The communication is based on a short range RF link (up to 10-20 cm) working at 13.56 MHz with a data speed of  106 kbit/s to 848 kbit/s. Only the initiator part of two way communication is required to be driven actively, while the other side can be passively powered by the RF-field.

Applications that use this communication channel include contactless payment, ticketing, access control, easy device association, profile exchange (business card transfer), device authentication and many more. The NXP NFC related product portfolio embraces all components related to NFC including the RF-interface supporting all released NFC standards, the secure element enabling contactless payment and certified software stacks. Read more..

EMI-filter with ESD-protection

The increasing complexity in mobile applications has lead to an increase in interface signal frequencies, external interfaces and, especially, an increase in consumers who rely on their in mobile devices. For user accessible interfaces, a rugged ESD protection is mandatory to avoid damage or failure of the mobile.

The increase in signal speed/frequency leads to EMI radiation from signal busses operating at higher frequency ranges. For example, the microSD card bus speed up to 100MHz clock and MIPI lanes with 600 MHz and more. The increase in fundamental bus frequencies leads to a growing importance of EMI-filtering to minimize harmonic frequencies within the mobile communication bands.  Read more..


There is an increase in multiple RF frequency and RF system integration into portable appliances at the request of the consumers. The need for higher performance requires maximum sensitivity from receiver antennas without being disturbed by jammers and other disturbances from different RF systems. NXP’s LNA require an industry minimum in external components, while offering a top noise and jammer suppression performance.

Housed in an extremely small package, NXPs latest LNA requires only one external matching inductor and one external decoupling capacitor. It adapts itself to the changing environment in response to the presence of different radio systems. Read more …

Memory Card Interfaces

According the IEC61000-4-2 standard, SD host interfaces require additional high-level ESD protection, in addition to the integrated ESD protection which is typically very weak. Other strict EMI regulations and system requirements, as specified in GSM mobile phones, strongly request filters that reduce the radiated/conducted EMI. However, they must still comply with the electrical requirements of the interface specification.

The continuing trend of miniaturization of portable appliances implies that interface devices offering ESD protection and EMI filtering should also integrate biasing circuits/resistors into a single small-sized package. NXP’s memory card interface solutions fully support this continuing trend and offer interface conditioning functions such as high-level ESD protection according the IEC61000-4-2 standard.  They also support EMI filtering, integrated biasing resistor networks, regulated power supply to supply SD-memory cards directly from a battery, and voltage level translation to enable the use of low-voltage host processors to communicate with 2.7 V to 3.6 V compliant SD-memory card devices.

Charger interface

Whether your device is charged via the USB port or a separate charger, it is exposed to incorrect polarity or abnormally high voltages. Any of these two occurrences poses a threat to the charger circuit and the PMU of the mobile device. In addition, the USB/charger port can be subject to ESD strikes and other transient discharges.

NXP offers an application specific portfolio of TVS diodes and ESD arrays, which enable cost efficient protection solutions - ESD, reverse polarity, overvoltage, other transient discharges – with the smallest footprint.

Li-Ion battery charging topologies

Battery chargers using external pass elements can be grouped into two main paths - Bipolar Junction Transistor (BJT) and MOSFET - with additional back drive protection. NXP is offering cost efficient pass elements such as bipolar transistors, MOSFET & FETky for all use cases related to battery charging.


The impedance matched (100 ohm differential) TMDS lines are critical for the design of an HDMI interface, with minimal line capacitance to allow maximized EYE openings of the differential signals and robust system level ESD protection. The EYE open pattern test is actively supported by NXP, which is a founding member of the HDMI consortium. Our Authorized Test Center in Caen, France, offers HDMI compliance measurements including TDR and our development teams can assist with the more challenging aspects of HDMI, including HDCP keys.

Our low power HDMI transmitters connect to a 3 x 8 DVI and offer support for CEC and HDCP. It is backward compatible with DVI 1.0 and can be connected to any DVI 1.0 or HDMI sink. Our HMDI ESD protection saves mobile devices from ESD strikes and transient discharges when the HDMI cable is connected between source and sink devices such as TVs, mobile phones, media boxes and other sources.

Our HDMI Interface conditioning solutions provide a clean, straight forward routing option with hardly any discrete components. These devices integrate functions such as level shifting to bridge the voltage levels demanded by the HDMI interface specification and sub-µ technology system chips of mobile devices no longer supporting high voltage levels. Read more …

Mobilized multimedia

NXP offers comprehensive software solutions for mobilized multimedia, simplifying the user interface, enhancing the user experience and shortening the design cycle. Ease of use, image and audio quality are all key considerations during the manufacture of our mobilized multimedia products. Read more…


Diode & Transistors

Documentation for this application

File nameTitleTypeFormatDate
AN10733Photo flash LED driver (2.0)Application notepdf2010-03-12
AN10914SIM card EMI filtering and ESD protection using integrated discretes (1.0)Application notepdf2010-06-02
AN10911SD(HC)-memory card and MMC interface conditioning (1.0)Application notepdf2010-04-29
AN10910Protecting charger interfaces and typical battery charging topologies with external bypass transistors (1.0)Application notepdf2010-04-29
AN10832PCF8883 - capacitive proximity switch with auto-calibration (3.0)Application notepdf2010-09-14
NXP_Mobile_UsageIntergrated discretes, interface conditioning and interface protection in mobile appliances (8.0)Brochurepdf2010-07-02
75015768Robust serial link for mobile applications; NXP mobile interface link PTN3700 (1.0)Leafletpdf2006-10-01
75016672Maximum flash/torch efficiency and light from a small footprint; NXP 500 mA, dual-LED flash drivers SSL3250A/SSL3252 (1.0)Leafletpdf2009-02-01
7501679830 dB EMI filter with up to 30 kV IEC contact ESD protection in leadless packages; NXP multi-channel ESD protection and EMI filter IP425xCZ8-4/CZ12-6/CZ16-8 IP4256CZ3-M/CZ5-W/CZ6-F (1.0)Leafletpdf2009-09-01
75017060TFA9882 - Digital I2S-input mono 3.4 W Class-D audio amplifier for portable applications (1.0)Leafletpdf2011-04-05
75016197A better Class-D amplifier for mobile and wired applications; NXP 3.0-W mono, filter-free, Class-D audio power amplifier SA58672UK (1.0)Leafletpdf2008-08-01
75016787SA58635 - 2x 25 mW Class-G stereo headphone driver with I2C-bus control (1.0)Leafletpdf2011-04-05
75016799Low-power, high-speed, dual-supply voltage translation (0.8 to 5.5 V) (1.0)Selection guidepdf2009-09-01
75017090Application guide; Portable devices and mobile handsets (3.0)Selection guidepdf2011-08-15
tn_analog_digital_switchesFeatures and applications of switches (1.0)Technical notepdf2009-04-15

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