New FlatPower packages with MEGA Schottky rectifiers
NXP releases new SOD123W and SOD128. Due to the packages' clip bond technology, the new MEGA devices deliver high-power capability comparable to SMA packages. At the same time, the package height is just 1 mm instead of 2 mm, enabling much smaller designs
SimPort - Free MOSFET simulation tool
NXP's SimPort is a live interactive environment to simulate MOSFET performance and provides analysis beyond that available from a data sheet.
Now available, NXP RF Manual 11th edition!
NXP's RF Manual makes design-in work much easier. In this 11th edition we added several new applications, exciting new developments and products.