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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

Typenumber	Package	Package description	Moisture Sensitivity Level	Total product weight
74AHC86D	SOT108-1	SO14	1	118.66 mg

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Lead Frame Material 极片材料	O	O	O	O	O	O
Pre-plating 预电镀	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Die 晶粒	O	O	O	O	O	O
Adhesive 粘合剂	O	O	O	O	O	O
Wire 线	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All NXP Semiconductors products have an environmental friendly use period (EFUP) of 50 years.

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Typenumber	Package	Package description	Moisture Sensitivity Level	Total product weight
74AHC86D	SOT108-1	SO14	1	118.66 mg

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%)
Lead Frame Material	Copper alloy	Iron (Fe)	7439-89-6	01.13	02.40
		Copper (Cu)	7440-50-8	45.80	97.47
		Phosphorous (P)	7723-14-0	00.01	00.03
		Zinc (Zn)	7440-66-6	00.05	00.10
		SubTotal		46.99	100.00
Pre-plating	Pure metal layer	Palladium (Pd)	7440-05-3	00.02	02.00
		Nickel (Ni)	7440-02-0	01.20	97.00
		Gold (Au)	7440-57-5	00.01	01.00
		SubTotal		01.23	100.00
Mould Compound	Flame retardant	Misc. Bromine Compounds		00.87	01.50
	Filler	Misc. silica compounds		41.75	72.00
	Polymer	Epoxy resin system		13.28	22.90
	Flame retardant	Antimony trioxide	1309-64-4	02.09	03.60
		SubTotal		57.99	100.00
Die	Doped silicon	Silicon (Si)	7440-21-3	00.43	100.00
Adhesive	Filler	Silver (Ag)	7440-22-4	08.14	69.00
	Polymer	Resin system		03.66	31.00
		SubTotal		11.80	100.00
Wire	Pure metal	Gold (Au)	7440-57-5	00.22	100.00
		Total		118.66	100.00

Note:

Miscellaneous Bromine Compounds are Brominated Flame Retardants which are not present in their free state in the finished product as they get incorporated into the epoxy polymer upon curing in the assembly process. Currently no CAS numbers have been allocated for these compounds.