As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, WEEE, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Typenumber	Package	Package description	Moisture Sensitivity Level	Total product weight
PNX1301EH	SOT553-1	HBGA292	NA	2673.56 mg

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Wire 线	O	O	O	O	O	O
Die 晶粒	O	O	O	O	O	O
Adhesive 粘合剂	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Adhesive 粘合剂	O	O	O	O	O	O
Solder Ball 焊球	X	O	O	O	O	O
Lead Frame Material 极片材料	O	O	O	O	O	O
Heat Spreader Material 散热材料	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the ST/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All NXP Semiconductors products have an environmental friendly use period (EFUP) of 50 years.

Disclaimer 免责声明

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Typenumber	Package	Package description	Moisture Sensitivity Level	Total product weight
PNX1301EH	SOT553-1	HBGA292	NA	2673.56 mg

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%)
Wire	Pure metal	Gold (Au)	7440-57-5	04.05	100.00
Die	Doped silicon	Silicon (Si)	7440-21-3	53.59	100.00
Adhesive	Polymer	Resin system		01.66	20.50
	Filler	Silver (Ag)	7440-22-4	06.43	79.50
		SubTotal		08.09	100.00
Mould Compound	Polymer	Epoxy resin system		105.15	12.00
	Filler	Misc. silica compounds		771.08	88.00
		SubTotal		876.23	100.00
Adhesive	Polymer	Resin system		00.05	13.00
	Filler	Silver (Ag)	7440-22-4	00.32	87.00
		SubTotal		00.37	100.00
Solder Ball	Tin alloy	Tin (Sn)	7440-31-5	355.19	63.00
		Lead (Pb)	7439-92-1	208.60	37.00
		SubTotal		563.79	100.00
Lead Frame Material	Filler	Misc. silica compounds		00.18	18.00
		Non hazardous		00.19	19.00
	Polymer	Epoxy resin system		00.14	13.50
	Pure metal	Nickel (Ni)	7440-02-0	00.01	00.60
	Filler	Not disclosed by Subco.		00.02	01.60
	Polymer	Resin system		00.07	06.60
	Pure metal	Copper (Cu)	7440-50-8	00.41	40.60
		Gold (Au)	7440-57-5	00.00	00.10
		SubTotal		01.02	100.00
Heat Spreader Material	Pure metal	Copper (Cu)	7440-50-8	1166.42	100.00
		Total		2673.56	100.00

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.