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Chemical content
As a proactive and sustainable company, NXP has decided to publish chemical content information of its product
portfolio through direct Internet access.
With this information, we can provide data to our customers
to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has
set a standard in the semiconductor business with this detailed level of data, directly retrieved from its
general product database.
NXP products are compliant to the EU Directives RoHS, WEEE, ELV and the China
RoHS.
Please see also our
Restricted Substances Declaration.
| Typenumber | Package | Package description | J-STD-20D Moisture Sensitivity Level | Total product weight |   |
| 74LVCH322245AEC | SOT536-1 | 4 | 196.73 mg |
| 12NC | Effective | Version | Peak package temperature Lead-Free | Max time at peak temperature Lead-Free | Peak package temperature Leaded | Max time at peak temperature Leaded | Number of processing cycles | Assembly site |
|---|---|---|---|---|---|---|---|---|
| 935263932518 | 06-jan-09 | 8 | 260 | 30 seconds | 240 | 20 seconds | 3 | External manufacturing |
| 935263932551 | 06-jan-09 | 8 | 260 | 30 seconds | 240 | 20 seconds | 3 | External manufacturing |
| 935263932557 | 06-jan-09 | 8 | 260 | 30 seconds | 240 | 20 seconds | 3 | External manufacturing |
| Chemical Content | China RoHS information |
| Subpart | Material group | Substances | CAS number | Mass(mg) | Mass(%) |
|---|---|---|---|---|---|
| Solder Ball | Tin alloy | Lead (Pb) | 7439-92-1 | 14.06 | 37.00 |
| Tin (Sn) | 7440-31-5 | 23.95 | 63.00 | ||
| SubTotal | 38.01 | 100.00 | |||
| Lead Frame Material | Filler | Misc. silica compounds | 17.54 | 33.10 | |
| Not disclosed by Subco. | 01.01 | 01.90 | |||
| Pure metal | Copper (Cu) | 7440-50-8 | 08.64 | 16.30 | |
| Gold (Au) | 7440-57-5 | 00.16 | 00.30 | ||
| Flame retardant | Misc. Bromine Compounds | 03.50 | 06.60 | ||
| Polymer | Epoxy resin system | 14.20 | 26.80 | ||
| Pure metal | Nickel (Ni) | 7440-02-0 | 00.64 | 01.20 | |
| Polymer | Resin system | 03.97 | 07.50 | ||
| Filler | Non hazardous | 03.34 | 06.30 | ||
| SubTotal | 53.00 | 100.00 | |||
| Mould Compound | Flame retardant | Misc. Antimony compounds | 01.41 | 01.50 | |
| Polymer | Epoxy resin system | 18.80 | 20.00 | ||
| Flame retardant | Tetrabromobisphenol A | 79-94-7 | 00.94 | 01.00 | |
| Filler | Misc. silica compounds | 72.84 | 77.50 | ||
| SubTotal | 93.99 | 100.00 | |||
| Adhesive | Polymer | Resin system | 01.50 | 25.00 | |
| Filler | Silver (Ag) | 7440-22-4 | 04.50 | 75.00 | |
| SubTotal | 06.00 | 100.00 | |||
| Die | Doped silicon | Silicon (Si) | 7440-21-3 | 02.50 | 100.00 |
| SubTotal | 02.50 | 100.00 | |||
| Wire | Pure metal | Gold (Au) | 7440-57-5 | 03.23 | 100.00 |
| SubTotal | 03.23 | 100.00 | |||
| Total | 196.73 | 100.00 | |||
| Note: |
| Miscellaneous Bromine Compounds are Brominated Flame Retardants which are not present in their free state in the finished product as they get incorporated into the epoxy polymer upon curing in the assembly process. Currently no CAS numbers have been allocated for these compounds. |
| Disclaimer |
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |