This simple guide offers you answers to some of the most common questions about NXP's lead-free solutions. Many other aspects of Pb-free are covered within the rest of this website.
General
Q. What is the NXP position on “China RoHS”?
Read our explanatory statement on the 
“Chinese Administration on the Control of Pollution caused by
Electronic Information Products (ACPEIP)”
Q. What is the meaning of the 
symbol?
EU/CN RoHS Compliant
NXP Semiconductors certifies that to the best of their knowledge these products are meeting the requirements of the European Union's Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive 2002/95/EC and can therefore be called EU RoHS compliant.
These products have lead free terminations and no use has been made of an exemption under the EU RoHS directive.
These products also meet the requirements of the Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products), the "China RoHS".
NXP cannot warrant that products from NXP Semiconductors' customers, in which such NXP products are incorporated, will in turn comply with the European Union's Directive 2002/95/EC and/or with the Chinese ACPEIP.
Q. What is the meaning of the 
symbol?
EU RoHS Compliant
NXP Semiconductors certifies that to the best of their knowledge these products are meeting the requirements of the European Union's Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive 2002/95/EC and can therefore be called EU RoHS compliant.
These products have lead free terminations but use has been made of an exemption under the EU RoHS directive. For example products with lead in high melting temperature solders used for die-attach or glass-diodes containing lead.
NXP Semiconductors cannot warrant that products from NXP Semiconductors' customers, in which such Philips Semiconductor products are incorporated, will in turn comply with the European Union's Directive 2002/95/EC.
Q. Why lead-free?
Environmental improvement (reduction or elimination of the potential hazardous effects from lead poisoning). NXP promotes lead-free manufacturing, which is mandated by legislation and supported by strong market demand.
Q. What is the definition of Pb-free?
Content less than 1000 ppm Pb by weight (E3). See our lead free declaration: NXP Semiconductors RoHs Declaration
Q. How are lead-free NXP Semiconductor packages identified?
A Pb-free logo will be added to the label (see example below). Where there is not room for this a self-adhesive sticker, shown below, is attached to both reel and SPQ.
Technical aspects
Q. Are lead-free NXP devices compatible with conventional (Sn/Pb solderpaste) soldering processes?
Yes. For many years our products have been suitable for the higher temperature profiles required by most lead-free soldering processes. Full forward / backward compatibility (exception is the BGA-family as conventional reflow temperatures are too low for melting SAC solderball) is ensured because all lead-free devices have either pure tin or NiPdAu plating. As with any change it may be necessary to re-optimize the soldering processes. As with any change it may be necessary to re-optimize the soldering processes.
Q. Does pure tin plating have any effect on external / internal dimensions, or mechanical and electrical behaviour?
All dimensions and both mechanical and electrical behaviour are unaffected. Also, no change in the distribution of electrical parameters has been detected.
Q. Do higher soldering temperatures have any negative impact on the moisture sensitivity level (MSL)?
For our small-signal discrete products there is no impact on the MSL. For ICs, in about 70% of cases there is no change while for the remaining 30% some change in MSL is likely. Please check out the individual package information for more detailed information.
Q. Do Pb-free products have any impact on shelf life?
No. Guaranteed shelf life remains the same as for current SnPb products.
Q. What are NXP Pb-free solutions?
- Pure tin (100% Sn)
- 100% Sn + postbake for packages such as QFP / PLCC
- NiPdAu for packages including SO / SSOP / TSSOP / HTSSOP / HVQFN
- SnAgCu for BGA-like packages
Q. Why is pure tin used?
Through many years experience NXP has found pure tin to be the proven, logical choice for coating package leads / terminals, enabling ideal drop-in replacements for devices using lead-alloy platings.
Q. What measures are taken by NXP to prevent whisker growth on products?
Along with thorough test procedures, the following measures are introduced into the production process:
- use of the appropriate leadframe material
- application of the proper chemicals
- leadframe pre-treatment prior to plating
- tightly controlled, minimum plating thickness
- post bake (not discretes)
We have investigated whisker behaviour of our products for more than two years and no serious whisker growth has been detected.
Q. What is the meaning of the RHF-2006 indicator?
RHF = RoHS Halogen Free indicator. The RHF-2006 indicator has been introduced by NXP in order to identify compliancy to and will be used in the marking of commercial products and on their packing labels. RHF-2006 identification codes:
(Non-RoHS compliant) = All non-RoHS compliant products (regardless of being halogen/antimony-free). For example products with Lead in the outer terminals like QFP with traditional SnPb plating and BGA's with SnPb balls
(Exempted) = Products containing exempted Lead that do contain Halogens/Antimony. For example products with eutectic solder die-attach (HSOP/SIL-P) packages and glass-diodes containing Lead
(Green) = Products which fully comply to the EU Directive 2002/95/EC (RoHS)
(Halogen/Antimony-Free = Products containing exempted Lead, but Halogen-Antimony-Free
(Dark-Green) = Products as G, but in addition free of Halogens/Antimony
Q. RHF-2006 indicator: What is the definition of Green?
When a product is identified as G(reen), it implies to be RoHS compliant per below limits:
| Substances | Threshold Limit | |
| Lead | < 1000 ppm (0.1 %) | |
| Mercury, Chromium (VI), PBB's and PBDE's | < 1000 ppm (0.1 %) | |
| Cadmium | < 100 ppm (0.01%) |
Substances above are not intentionally added, but might be present as an impurity with an upper limit according to the listed values.
Threshold limits refer to the individual homogeneous materials (such as post-plating, adhesive, substrate, mould compounds etc.)
Q. RHF-2006 indicator: What is the definition of Dark-Green?
When a product is identified as D(ark-Green), it implies to be RoHS compliant AND Halogen-Antimony-Free per below limits:
| Substances | Threshold Limit | |
| Antimony Oxides | < 900 ppm (0.09%) | |
| Chlorinated + Brominated Flame Retardants S | < 900 ppm (0.09%) |
Substances above are not intentionally added, but might be present as an impurity with an upper limit according to the listed values.
Threshold limits refer to the individual homogeneous materials (such as post-plating, adhesive, substrate, mould compounds etc.)