In automotive systems space is becoming a key issue, especially under the hood. Today's MOSFETs need to provide the absolute best thermal performance possible to enable switching of loads requiring significant currents. In answer to this, NXP has extended its successful High Performance Automotive (HPA) range of MOSFETs with the introduction of the SOT669 Loss Free PAcKage (LFPAK) to ensure a superior level of on-resistance and thermal performance in an extremely compact housing. The combination of NXP's advanced TrenchMOS technology and LFPAK delivers compact power to many applications that previously were limited to only large discrete power packages.

Key features

• Low on-resistance HPA TrenchMOS technology
• SO8 compatible footprint area
• Very low thermal resistance, equivalent to DPAK
• Low profile further reducing space requirements
• Universal solder land for all die sizes
• Conventional surface mount leads allowing optical inspection of solder joints

Key benefits

• Increased device efficiency
• Faster switching
• Cooler-running applications
• Reduced PCB size

Key applications

• Petrol and diesel engine management systems
• Automotive motor drives where control electronics must be integrated
• General-purpose automotive switching where space is at a premium

Related links

•  BUK9Y11-30B
•  BUK7Y13-40B
•  BUK9Y14-40B
•  BUK9Y19-55B
•  BUK9Y40-55B
•  BUK9Y30-75B
•  BUK9Y53-100B
•  HPA TrenchMOS in LFPAK
•  High-performance MOSFETs for automotive systems

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