One of the main drivers in the portable device market is the desire to squeeze ever more functionality into the same, or even less, space. This makes power density and power dissipation key design elements. Our latest power MOSFETs in the SOT883 leadless package tackle these issues head-on, helping you reclaim more board space while enhancing thermal performance at the same time. With a 1.0 x 0.6 mm footprint, NXP's MOSFETs in SOT883 are among the smallest in the world yet still deliver the highest performance.
Key benefits
- Better performance than existing small footprints
- higher power dissipation and lower RDSon, with higher current density
- larger die size capability whilst utilizing same overall footprint as leaded counterpart
- reduced heat dissipation may eliminate need for cooling fan or bulky heat sink
- Occupies only 1.17 mm², 30% less than SC-75 or SC-89
Key features
- 2.5 W power dissipation
- Environmentally friendly
- Compatible with JEITA standard, SC-101
- Small size: 1.0 x 0.6 x 0.5 mm (lwh)
Key applications
- Load switch
- mobile phones
- notebook PCs
- PDAs
- MP3 players
- digital still cameras
- External pass device
- buck converters
- boost converters
SOT883 package
The SOT883 package platform is built in a Quad Flat Non-leaded technology (QFN), a well-known and proven technology for ICs. In terms of power dissipation, the leadless layout ensures the SOT883 offers comparable efficiency to the SOT23. NXP's SOT883 platform is also environmentally friendly, with pure tin plating, green plastic and the highly efficient packing method - already standard for passive components - meeting all environmental protection targets.
Product overview
Related links
- How much space can you save, using NXP's leadless multimarket semiconductors portfolio?
World's smallest MOSFETs leaflet- World's smallest MOSFETs PR
- Power Management Selection Guide 2008
- SOT883 package outline
- SimPort
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