Philips RF SiP sets new standard in GSM/GPRS/EDGE radio size
50% size reduction in RF transceiver application allows additional feature integration in Nexperia Cellular System Solutions
Royal Philips Electronics (NYSE: PHG, AEX: PHI) today announced the introduction of a RF System-in-a-Package featuring a dramatic reduction of component count in the RF section of Nexperia Cellular System Solutions. In addition to providing additional board space, the UAA3587 allows manufacturers to make significant savings. The plug-and-play integration eases the design-in process, improves the PCB (printed circuit board) reliability and facilitates the multimedia features integration. As a result, manufacturers can bring highly competitive handsets faster to the market.
Eliminating the passive components and providing a higher miniaturization level is one of the industry’s major challenges. Operating modes and frequency bands are increasing while the phone form factors are decreasing. With up to four GSM bands, GPRS, EDGE and integration of 3G, Bluetooth, FM radios, the RF transceivers require a more accurate performance of the passive components, to manage the overall system complexity.
“In a fiercely competitive market, passive integration technology on the RF front-end provides a critical advantage. Handset makers can save board space, drastically reduce engineering hours and get their products quickly to market,” said Gert-Jan Kaat, senior vice president of Mobile Communications, Philips Semiconductors.
The UAA3587 is the first highly integrated cellular transceiver to be produced using Philips’ new silicon-based RF SiP technology. This new technology utilizes back-end silicon processing to integrate passive components (particularly high-density capacitors) onto a silicon substrate that then acts as a carrier for the necessary active component dies. The active dies are direct-bonded to the passive component silicon using flip-chip techniques. This sub-assembly is then molded in a standard plastic package.
The advantages of Philips’ silicon-based RF SiP technology are that it allows the integration of high-quality passive components using relatively low-cost silicon processing, while allowing active components such as the transistors to be fabricated for optimum performance in other process technologies – for example, Philips’ QUBiC BiCMOS or a GaAs process.
The first cellular IC to be developed is the RF transceiver UAA3587, which will become the heart of the RF front-end of Nexperia Cellular System Solutions. It reduces the number of components for the RF part on the PCB (Printed Circuit Board) by 35 compared to the previous generation and enables designs of less than 2.50 cm2. Combined with the miniaturisation of other components, this is a saving of more than 30 percent against the best in class. In comparison with the industry average, this size reduction is as high as 50 percent for a more advanced RF functionality.
Philips pioneered the system solution approach in 1999. As a worldwide leader in cellular communications, Philips offers a global network of expertise to help customers succeed.
Availability
UAA3587 GPRS version will go into mass production by Q3 2004; EDGE version will follow in Q1 2005. The UAA3587 RF transceiver is available for order in quantities of 100,000 units.
Note to editors
Editors interested in learning more about the UAA3587 RF transceiver and Nexperia Cellular System Solutions are encouraged to visit Stand A6 in Hall 1 during the 3GSM World Congress, February 23-26, in Cannes, France.Background Information