NXP Semiconductors logo
Select site:
English
Product news
Press image
October 07, 2008

NXP delivers new FlatPower packages with best-in-class MEGA Schottky rectifiers


New devices enable lowest voltage drop and smaller designs


Eindhoven, Netherlands, October 7, 2008 – NXP Semiconductors, the independent company founded by Philips, today announced a new range of MEGA Schottky rectifiers housed in its new FlatPower packages, SOD123W and SOD128. As a result of the packages' clip bond technology, the new MEGA devices deliver high-power capability comparable to standard SMA packages: Boosting the best-in-class low forward voltage-drop, the new types allow a high peak current of more than 50 A and achieve power dissipation Ptot up to 1 W.

 

At the same time, the height of both packages is reduced by 50 percent compared to SMA packages, thus enabling much smaller designs. The SOD123W supports this trend with a body size of 2.6 mm x 1.7 mm x 1 mm; the dimensions of the SOD128 are 3.8 mm x 2.5 mm x 1 mm. Both packages are footprint-compatible to SMA and SMB packages, providing an ideal solution for a 1:1 replacement.

 

“The market is increasingly demanding thinner and more powerful devices. With the new FlatPower packages, NXP has developed a technology that enables smaller designs, delivers high performance and still enables the lowest forward voltage-drop – which is crucial especially for battery-driven systems,” said Wolfgang Bindke, product marketing manager for diodes, NXP Semiconductors.

 

The MEGA Schottky rectifiers are designed for a broad range of low-voltage and mobile applications including power management circuits, DC/DC converters, step down and synchronous converters, and free-wheeling diodes for inductive load in motors and relays. Qualified to the rigorous AEC-Q101 standard, the new FlatPower diodes can be used for automotive and industrial applications.

 

The SOD123W and SOD128 MEGA Schottkys meet the following environmental protection targets. The plastic is free of halogens and antimony oxides and complies with non-flammability classification UL 94V-0 and RoHS standards

 

Availability and Pricing

Six 30 V and 40 V low VF types in the new FlatPower packages are released and ready for production. Samples are available immediately for design-in.

 

Another six 20 V and 30 V low VF types will be released in the first quarter of 2009. An additional 15 types with up to 60 V and low VF are in development for release in the third quarter 2009.

 

The prices for the final series with 26 types will range from $5 to 9 (USD) per 100 pieces.

 

Specifications of available types (single diode configuration)

 

SOD123W

SOD128

IF [max] [A]

VR [max] [V]

VF [max] [mV]

IR [max] [mA]

IFSM [max] [A]

PMEG2010ER   1 20 340 1 50
PMEG3010ER PMEG3010EP 1 30 360 1.5 50
PMEG4010ER PMEG4010EP 1 40 490 0.05 20
PMEG3020ER   2 30 420 1.5 50

 

Further information is available at http://www.nxp.com

 

The new FlatPower packages complement NXP Semiconductors’ discrete package portfolio, which includes small leadless packages with dimensions starting from 1.0 x 0.6 x 0.4 mm, as well as medium power packages.

 

About NXP Semiconductors

NXP is a leading semiconductor company founded by Philips more than 50 years ago. Headquartered in Europe, the company has 31,000 employees working in more than 20 countries and posted sales of USD 6.3 billion (including the Mobile & Personal business) in 2007. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in TVs, set-top boxes, identification applications, mobile phones, cars and a wide range of other electronic devices. News from NXP is located at www.nxp.com.