Philips Semiconductors delivers USB On-The-Go chip for direct connectivity
Philips Semiconductors, a division of Royal Philips Electronics (NYSE: PHG, AEX: PHI), today announced that its Universal Serial Bus (USB) On-The-Go (OTG) chip is available to allow flexible and cost effective point-to-point communications between devices such as mobile phones, digital cameras, digital video cameras, digital audio players, printers and PDAs. This single-chip product, the ISP1362, is fully compliant with the USB Implementers Forum's (IF) OTG Supplement to the USB 2.0 Specification. This new USB OTG chip permits mobile devices to communicate at times when there is no personal computer available to act as a go-between for data exchange.
"As a core team member of the USB-IF and OTG working groups, Philips Semiconductors is committed to providing complete USB and OTG products," said Rajeev Mehtani, product line manager, Wired Connectivity, Philips Semiconductors. "By leveraging our collaboration with leading platform makers and embedded OS vendors, Philips is able to deliver innovative OTG compliant system solutions."
As the first in a series of Philips Semiconductors' USB OTG products, the ISP1362 offers a powerful USB architecture, based on years of USB experience. The ISP1362 is an OTG compliant USB 2.0 host and peripheral controller. These capabilities allow the chip to act as USB host, USB peripheral, or both functions simultaneously. The host and peripheral roles can be interchanged through the Host Negotiation Protocol (HNP). The HNP feature, which allows the host function to be transferred between two devices, eliminates the need to switch cables. Using this feature, manufacturers of dual-role devices can determine which peripherals its device will support.
Philips Semiconductors developed the industry's first USB OTG prototype, which in turn was used to qualify the USB OTG supplement leading to the supplement's public release in September 2001.
The ISP1362 single-chip IC will sample in February 2002 with volume production scheduled for the second quarter of 2002. The ISP1362 will be available in the LQFP64 package. Please visit http://www.semiconductors.philips.com/buses/usb/ for additional information.
About Philips Semiconductors
Philips Semiconductors, with revenues of US $6.3 billion in 2000, is a world leader in silicon systems and standard products for wireless communications, digital entertainment, computing and automotive applications. The organization designs, develops and manufactures silicon solutions based on its innovative Nexperia™ architecture to create living technology for its customers building products, service providers using the products, and consumers enjoying the resulting products and services. For more information: www.semiconductors.philips.com.