High reliability Automotive MOSFETs

April 16, 2010
High Reliability Automotive MOSFETs

LFPAK MOSFETs for Automotive

NXP LFPAK is optimized for high-density automotive applications, delivering the ideal combination of ultra-low package resistance, superior reliability and thermal performance. All this in a very small package that ensures you can put power where you need it most, anywhere in the car.

Key benefits

 

Target applications

  • Low inductance
  • Low thermal resistance
  • Dimensions comparable to SO8
  • Significantly thinner than SO8 & DPAK
  • Wirebond free - Cu clip design
  • High current transient robustness
  • 100% avalanche tested
  • Automotive AEC-Q101 qualified to 175 °C
  • Leads are optical-inspection friendly
 
  • Engine and transmission controllers
  • Advanced braking systems
  • Coolant pumps
  • DC/DC converters
  • Reverse battery protection
  • General-purpose automotive switching where space is at a premium

Selection Guide

VDS (V) RDSon (max) @ VGS = 10 V (mΩ) RDSon (max) @ VGS = 5 V (mΩ) ID(max) @ 25 °C (A) Rth(j-mb)Max (K/W) Type
30 7   75 1.4 BUK7Y07-30B
6 7 75 1.4 BUK9Y07-30B
10   67 1.8 BUK7Y10-30B
9 11 59 1.8 BUK9Y11-30B
20   39 2.5 BUK7Y20-30B
19 22 38 2.5 BUK9Y22-30B
40 8   75 1.4 BUK7Y08-40B
8 9 75 1.4 BUK9Y09-40B
13   58 1.8 BUK7Y13-40B
11 14 56 1.8 BUK9Y14-40B
25   35 2.5 BUK7Y25-40B
24 27 34 2.5 BUK9Y27-40B
55 12   62 1.4 BUK7Y12-55B
11 12 62 1.4 BUK9Y12-55B
18   47 1.8 BUK7Y18-55B
17 19 46 1.8 BUK9Y19-55B
35   28 2.5 BUK7Y35-55B
36 40 26 2.5 BUK9Y40-55B
75 18   49 1.4 BUK7Y18-75B
18 19 48 1.4 BUK9Y19-75B
28   35 1.8 BUK7Y28-75B
28 30 34 1.8 BUK9Y30-75B
54   21 2.5 BUK7Y54-75B
53 58 21 2.5 BUK9Y58-75B
100 53   25 1.8 BUK7Y53-100B
49 53 23 1.8 BUK9Y53-100B
102   15 2.5 BUK7Y102-100B
99 104 15 2.5 BUK9Y104-100B

Related links

High Reliability LFPAK MOSFETs for Automotive Power Applications   Power MOSFETs for Automotive Applications - Selection Guide   LFPAK - The Toughest Power-SO8   LFPAK MOSFET Thermal Design Guide   Power MOSFET single-shot and repetitive avalanche ruggedness rating   Reflow soldering footprint

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