| Type number | Package | VDS | RDSon Max(mΩ) Vgs=10v | RDSon Typ (mΩ) Vgs=10v | Qg(tot) Typ nC Vgs=10v |
|---|---|---|---|---|---|
| PSMN3R5-30LL | QFN3333 | 30 | 3.55 | 2.9 | 37 |
| PSMN3R8-30LL | QFN3333 | 30 | 3.7 | 3 | 38 |
| PSMN5R8-30LL | QFN3333 | 30 | 5.8 | 5 | 30 |
| PSMN9R0-30LL | QFN3333 | 30 | 9 | 8 | 20.6 |
| PSMN013-30LL | QFN3333 | 30 | 13 | 11 | 12.2 |
| PSMN017-30LL | QFN3333 | 30 | 17 | 15 | 10 |
| PSMN7R0-40LS | QFN3333 | 40 | 7 | 5.6 | 21.4 |
| PSMN014-60LS | QFN3333 | 60 | 14 | 11 | 19.6 |
| PSMN023-80LS | QFN3333 | 80 | 23 | 19 | 21 |
| PSMN035-100LS | QFN3333 | 100 | 32 | 29 | 23 |

NXP now offers a range of high-performance MOSFETs rated from 30V to 100V in the QFN3333 package. Measuring only 3.3 mm x 3.3 mm x 1 mm, the devices share the same great switching performance as our Trench 6 LFPAK types but with a 60% smaller footprint. They are ideal for space-constrained designs and high-efficiency power switching applications.
Key benefits
- High efficiencies in power switching applications due to the optimized RDSon and gate charge (Qg) characteristics of Trench 6 technology
- Fast switching - optimized for higher switching frequencies, typically up to 500 KHz
- 1 mm package height for low-profile applications
- Solder die-attach provides superior thermal performance - Rth(j-mb)
- Reduced switching spikes
- Avalanche rated and 100% factory tested to ensure high reliability in your application
Key applications
- DC:DC converters - Point-of-Load modules
- Battery protection - Li-Ion battery packs
- Load switching
- Power ORing
- Voltage regulator modules (VRMs)
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