New Power switching MOSFETs in compact QFN3333

August 24, 2010

Type number Package VDS RDSon Max(mΩ) Vgs=10v RDSon Typ (mΩ) Vgs=10v Qg(tot) Typ nC Vgs=10v
PSMN3R5-30LL QFN3333 30 3.55 2.9 37
PSMN3R8-30LL QFN3333 30 3.7 3 38
PSMN5R8-30LL QFN3333 30 5.8 5 30
PSMN9R0-30LL QFN3333 30 9 8 20.6
PSMN013-30LL QFN3333 30 13 11 12.2
PSMN017-30LL QFN3333 30 17 15 10
PSMN7R0-40LS QFN3333 40 7 5.6 21.4
PSMN014-60LS QFN3333 60 14 11 19.6
PSMN023-80LS QFN3333 80 23 19 21
PSMN035-100LS QFN3333 100 32 29 23
QFN board

NXP now offers a range of high-performance MOSFETs rated from 30V to 100V in the QFN3333 package. Measuring only 3.3 mm x 3.3 mm x 1 mm, the devices share the same great switching performance as our Trench 6 LFPAK types but with a 60% smaller footprint. They are ideal for space-constrained designs and high-efficiency power switching applications.

Key benefits

  • High efficiencies in power switching applications due to the optimized RDSon and gate charge (Qg) characteristics of Trench 6 technology
  • Fast switching - optimized for higher switching frequencies, typically up to 500 KHz
  • 1 mm package height for low-profile applications
  • Solder die-attach provides superior thermal performance - Rth(j-mb)
  • Reduced switching spikes
  • Avalanche rated and 100% factory tested to ensure high reliability in your application

Key applications

  • DC:DC converters - Point-of-Load modules
  • Battery protection - Li-Ion battery packs
  • Load switching
  • Power ORing
  • Voltage regulator modules (VRMs)

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