Introducing a new range of medium power transistors in the very small DFN2020-3 (SOT1061) package. This AEC-Q101 qualified, 2 x 2 mm housing features an exposed heat sink, giving the devices excellent thermal and electrical performance.
Ideal for general purpose, power sensitive applications in mobile, automotive, industrial and household appliances, the new SOT1061 packaging can save up to 80 percent more PCB space compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 A.
When mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows Ptot levels of up to 1.1 W in a tiny footprint. Driven by miniaturization in chip design, NXP’s ultra-compact medium power transistors offer design engineers a flexible power transistor solution for designs focusing on space saving, energy efficiency and low heat dissipation. All NXP medium power transistors are automotive-qualified according to AEC-Q101.
Key benefits
- Ideal for medium power applications
- High power dissipation capability
- High energy efficiency due to less heat generation
- Excellent electrical performance in a 2 x 2 mm footprint
- 80% board space reduction (DFN2020-3 vs. SOT89)
Key features
- Leadless very small SMD plastic package with medium power capability
- Exposed heat sink for excellent thermal and electrical performance
- VCEO ranging from 20 V to 80 V
- High collector current capability IC (up to 2 A) and ICM (up to 3 A)
- AEC-Q101 qualified
Focus products
Related links
Medium power general purpose transistors linecard
NXP Launches Industry’s First Medium Power Transistors in 2x2-mm Leadless DFN Package
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