Diamond package, the world's smallest logic package

July 23, 2012

NXP’s new Diamond package is a game-changing solution that allows engineers to design within smaller geometries without increasing manufacturing costs.

Key features

  • 0.8 mm x 0.8 mm x 0.35 mm (W x L x H)
  • Easy-to-use 0.5 mm lead pitch
  • All 5-lead LVC and AUP functions are available

Related links

To learn more about this exciting new logic package, please visit our dedicated Diamond package page.

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