NXP’s new Diamond package is a game-changing solution that allows engineers to design within smaller geometries without increasing manufacturing costs.
- 0.8 mm x 0.8 mm x 0.35 mm (W x L x H)
- Easy-to-use 0.5 mm lead pitch
- All 5-lead LVC and AUP functions are available
To learn more about this exciting new logic package, please visit our dedicated Diamond package page.