ESD protection in ultra small DSN0603-2 (0201 inch)

May 21, 2012

As the world’s leading supplier for pure ESD protection NXP continuously extends its protection portfolio in the smallest available package in the market, the DSN0603-2 (SOD962). At only 0.6 x 0.3 x 0.3 mm in size (0201 inch outline), it's the ideal fit for protection solutions in smart phones or tablets. Despite their tiny dimensions the NXP ESD protection devices PESD5V0S1BSF, PESD5V0L1BSF and PESD5V0V1BSF in DSN0603-2 offer up to 30 kV ESD robustness according to IEC61000-4-2 and up to 8 A peak pulse current for an 8/20 µs pulse. Soon NXP will further grow this portfolio with Femto Farad capacitance devices with only 0.25 pF for ultra high-speed datalines.

Download datasheets

PESD5V0S1BSF Cd = 35 pF, Vesd = 30 kV, bidirectional
PESD5V0L1BSF Cd = 12 pF, Vesd = 30 kV, bidirectional
PESD5V0V1BSF Cd = 3.5 pF, Vesd = 15 kV, bidirectional

Key features

  • Ultra small package size of 0.6 x 0.3 mm
  • Ultra low package height of only 0.3 mm
  • Up to 30 kV ESD robustness according to IEC61000-4-2
  • Up to 8 A peak pulse current for an 8/20 µs pulse
  • Ultra low leakage current of 1 nA typical and 0.1 µA max.

Key benefits

  • Ultra small package dimensions to save PCB space
  • Allows ultra compact device design due to only 0.3 mm package height
  • A leakage current of only 1 nA typical makes the devices ideal for battery powered devices
  • The ESD robustness of up to 30 kV guarantees an optimal protection level against ESD strikes

Key applications

  • Interface protection for smartphones, tablet computers and other mobile devices
  • Data-, speaker- and microphone-line protection
  • Keypad protection

Related links

PESD5V0S1BSF product information page
PESD5V0L1BSF product information page
PESD5V0V1BSF product information page
Leadless ultra small plastic package DSN0603-2 (SOD962) outline and soldering information

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