LFPAK56 – shrinking the power footprint

NXP is expanding its range of automotive grade MOSFETs with the release of 54 new Trench 6 products in its LFPAK56 (Power-SO8), AEC-Q101 qualified package. Offering leading R_DS(ON) performance at 40, 60 & 80 V and industry benchmark current handling, this small outline package allows designers to save size and cost, providing a true alternative to traditional DPAK solutions. With a broad portfolio of 40, 60, 80 and 100 V devices for both logic level and standard level gate drives, NXP aims to be the supplier of choice for all your automotive MOSFET needs.

Key features & benefits

• A true alternative to DPAK
• > 55% footprint space saving compared to DPAK
• High I_D max rating – up to 100 A
• Automotive AEC-Q101 qualified to 175 °C
• Leading R_DS(ON) performance at 40, 60 & 80 V
• Copper clip technology for advanced robustness
• 100% avalanche tested for guaranteed quality
• Low thermal / package resistance
• Low package inductance for switching applications
• Power-SO8 compatible footprint
• Extensive product range

Target applications

• Motor drive e.g. fan control, pump control, seat control
• Engine management e.g. solenoid/valve control
• DC-DC converters
• LED lighting
• Braking
• Relay replacement
• General purpose