- NXP Announces The First Leadless Package With Tin-Plated, Solderable Side Pads - October 28, 2010
- NXP Semiconductors to Announce Third Quarter Financial Results on November 2nd, 2010 - October 20, 2010
- NXP LPC1100L and LPC1300L MCUs Based on ARM Cortex-M Series Achieve Industry’s Lowest 32-Bit Operating Power - October 19, 2010
- NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore - October 13, 2010
- NXP Introduces New Energy Metering Chip - October 11, 2010
- LA Metro selects NXP's MIFARE UltralightTM technology for paper ticketing - October 06, 2010
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