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Press releases of June 2009
+ Automotive  + Business & Technology  + Mobile Solutions  + Consumer 
+ Display Solutions  + Identification  + Multimarket Semiconductors  + Nexperia System Solutions 
+ Wired / Wireless Connectivity       



June 25, 2009
NXP and IBM launch first practical test of road user charging in the Netherlands
June 24, 2009
NXP Semiconductors draws USD 300 million under its revolving credit facility
June 24, 2009
NXP’s MIFARE DESFire EV1 Technology Receives Trusted Security Stamp of Approval
June 18, 2009
NXP Launches Breakthrough New Online Design Tool for Power Management IC’s Compliant with PMBus Protocol Specifications
June 18, 2009
NXP Announces Extension of the Early Tender Date and the Early Tender Results of its Cash Offer
June 15, 2009
NXP Semiconductors Expands Lowest Cost ARM9 MCU Series
June 10, 2009
NXP Provides Update on Cash Position
June 08, 2009
NXP Boosts RF Innovation with Next Generation SiGe:C BiCMOS QUBIC4 Technology
June 04, 2009
NXP Announces Offer to Purchase Notes for up to $300 Million in Cash
June 03, 2009
NXP Demonstrates Novel 3-way Doherty Reference Design, Setting Path for More Energy Efficient RF Base Stations
June 02, 2009
NXP Claims First-to-Market Leadership with High Speed Converters Compliant to New JEDEC Interface Standards
June 01, 2009
LA Metro selects NXP’s MIFARE Plus Microcontroller IC for Ticketing