NXP Semiconductors Hong Kong has been awarded the 2006 Hong Kong Awards For Industries: Technological Achievement Award for its cutting-edge packaging technology in ultra-thin-leadless-platform (UTLP). The objective of the Technological Achievement Award is to recognize excellence in technology and intellectual property of companies as well as their contribution to Hong Kong. This is the second time NXP Hong Kong has been honored by Hong Kong Awards for Industries. The Quality Award was handed over in 1999.

“Winning the Technological Achievement Award is a true reflection on how NXP’s vibrant media technology is enabling the end users’ better sensory experiences,” said Peter Yates, Senior Vice President, NXP Hong Kong. “This site has been established for 37 years in Hong Kong, manufacturing discrete products that serve our global customers and now acts as the innovation center for advanced technology. In addition to the Quality Award, we received back in 1999, winning the Technology Achievement Award is truly another proof point that NXP Hong Kong has been successfully transformed into an innovation center in advanced technology. We will continue to strive for technological advancement in developing outstanding products,” said Mr. Yates.

Mr. Peter Yates, SVP & GM IS&O at Exhibition Booth

Award presented by Mr. Genardini, CEO, HKSTP

NXP Team photo

The Award