NXP Semiconductors


Select site:

English

SOT1033-1

SOT1033-1 - plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 11 x 5 x 0.7 mm

Outline drawing
Documents
Products in this package

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT1033-1
HWQFN56Rplastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 11 x 5 x 0.7 mm 2007-12-01
Back to top