| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HBGA624 | plastic thermal enhanced ball grid array package; 624 balls; heatsink | - - - (EIAJ); - - - (JEDEC); - - - (IEC); | 2008-11-17 |
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SOT1095-1
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Related documents
- Handling precautions
- Mounting and soldering
- Thermal design