NXP Semiconductors


Select site:

English

SOT1114-1

SOT1114-1 - plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT1114-1
HWQFN56Rplastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm2008-10-29

Related documents

Mounting and soldering
Surface mount reflow soldering description
Handling precautions
Handling precautions
Thermal design
Thermal design considerations

Products in this package