| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HBGA324 | plastic thermal enhanced ball grid array package; 324 balls; heatsink | - - - (EIAJ); MS-034 (JEDEC); 144E (IEC); | 2009-06-09 |
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Related documents
- Handling precautions
- Mounting and soldering
- Thermal design