| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| BGA324 | plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm | MS-034 (JEDEC); 144E (IEC); | 2009-02-05 |
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- Handling precautions
- Mounting and soldering
- Thermal design