| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| BGA582 | plastic ball grid array package; 582 balls | - - - (EIAJ); MS-034 Compliant (JEDEC); - - - (IEC); | 2009-05-26 |
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SOT1139-1
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Related documents
- Handling precautions
- Mounting and soldering
- Thermal design