| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| SSOP16 | plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm | 2003-02-18 |
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- English
SOT519-1
Outline drawing
Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design
- Wave soldering
Products in this package
- ESD, EMI and signal conditioning
- Sensors
- Logic
- CBT3125 - Quadruple FET bus switch
- CBT3126 - Quad FET bus switch
- CBT3251 - 1-of-8 FET multiplexer/demultiplexer
- CBT3253A - Dual 1-of-4 FET multiplexer/demultiplexer
- CBT3257A - Quad 1-of-2 multiplexer/demultiplexer
- CBTS3253 - Dual 1-of-4 FET multiplexer/demultiplexer with Schottky diode clamping
- CBTS3257 - Quad 1-of-2 multiplexer/demultiplexer with Schottky diode
- NE1617A - Temperature monitor for microprocessor systems
- NE1617 - Temperature monitor for microprocessor systems
- NE1619 - HECETA4 Temperature and voltage monitor
- NX5DV330 - Quad 1-of-2 video multiplexer/demultiplexer
- CBT3125 - Quadruple FET bus switch
- Interface and connectivity