| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HTSSOP32 | plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad | MO-153 (JEDEC); | 2005-11-02 |
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SOT549-1
Outline drawing
Related documents
- Handling precautions
- Mounting and soldering
- Thermal design
