| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HBGA292 | plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink | MS-034 (JEDEC); 144E (IEC); | 2002-02-27 |
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SOT553-1
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Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design
