| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HBGA456 | plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink | MS-034 (JEDEC); 144E (IEC); | 2009-08-14 |
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- Mounting and soldering
- Thermal design
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