| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026 (JEDEC); | 2008-11-21 |
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Related documents
- Handling precautions
- Mounting and soldering
- Thermal design