| Package Version |
Package Name |
Package Description |
Reference codes |
Issue date |
SOT617-1
|
HVQFN32
|
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm |
--- (JEITA) MO-220 (JEDEC) --- (IEC)
|
2002-10-18 |
Footprints for mounting SOT617-1 package
Reflow soldering [pdf file] Mounting and soldering [pdf file]
|