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SOT617-1; plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm

+ Back to Package Main + General description + Outline drawing + Soldering information
+ Handling precautions + Thermal design        

General description

On this page you can find the package outline drawing and soldering information of this package.

Outline drawing of package SOT617-1

Package Version Package Name Package Description Reference codes Issue date
SOT617-1 HVQFN32   plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm --- (JEITA) MO-220 (JEDEC) --- (IEC)   2002-10-18

Footprints for mounting SOT617-1 package

Reflow soldering [pdf file]
Mounting and soldering [pdf file]