NXP Semiconductors


Select site:

English

SOT629-1

SOT629-1 - plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT629-1
HVQFN16plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mmMO-220 (JEDEC); 2002-10-22

Related documents

Handling precautions
IC26_CHAPTER_3
Mounting and soldering
AN10365
HVQFN_mounting.pdf
Reflow soldering
sot629-1_fr
Thermal design
IC26_CHAPTER_6