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SOT638-1; plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad

+ Back to Package Main + General description + Outline drawing + Soldering information
+ Handling precautions + Thermal design        

General description

On this page you can find the package outline drawing and soldering information of this package.

Outline drawing of package SOT638-1

Package Version Package Name Package Description Reference codes Issue date
SOT638-1 HTQFP100   plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026 (JEDEC)   2005-02-02

Footprints for mounting SOT638-1 package

Reflow soldering [pdf file]