| Package Version |
Package Name |
Package Description |
Reference codes |
Issue date |
SOT638-1
|
HTQFP100
|
plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
MS-026 (JEDEC)
|
2005-02-02 |
Footprints for mounting SOT638-1 package
Reflow soldering [pdf file]
|