NXP Semiconductors


Select site:

English

SOT650-2

SOT650-2 - plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT650-2
HVSON10plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm- - - (EIAJ); MO-229 (JEDEC); - - - (IEC); 2009-03-18

Related documents

Handling precautions
IC26_CHAPTER_3
Mounting and soldering
AN10365
Thermal design
IC26_CHAPTER_6