NXP Semiconductors


Select site:

English

SOT700-1

SOT700-1 - plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT700-1
LBGA156plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mmMO-192 (JEDEC); 2008-10-09

Related documents

Reflow soldering
sot700-1_fr
Mounting and soldering
Surface mount reflow soldering description
Handling precautions
Handling precautions
Thermal design
Thermal design considerations