| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| LBGA156 | plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm | MO-192 (JEDEC); | 2001-11-06 |
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Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design
