| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm | MO-220 (JEDEC); | 2002-10-21 |
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SOT758-1
Outline drawing
Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design
Products in this package
- Logic
- Interface and connectivity
- RF
