| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HTSSOP56 | plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad | MO-153 (JEDEC); 143E36T (IEC); | 2008-10-09 |
| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HTSSOP56 | plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad | MO-153 (JEDEC); 143E36T (IEC); | 2008-10-09 |