| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| BGA456 | plastic ball grid array package; 456 balls | MS-034 (JEDEC); 144E (IEC); | 2008-06-09 |
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SOT795-1
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Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design
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