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SOT802-2; plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm

+ Back to Package Main + General description + Outline drawing + Soldering information
+ Handling precautions + Thermal design        

General description

On this page you can find the package outline drawing and soldering information of this package.

Outline drawing of package SOT802-2

Package Version Package Name Package Description Reference codes Issue date
SOT802-2 TFBGA160   plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm --- (JEITA) --- (JEDEC) --- (IEC)   2005-07-13

Footprints for mounting SOT802-2 package

Reflow soldering [pdf file]