| Package Version |
Package Name |
Package Description |
Reference codes |
Issue date |
SOT802-2
|
TFBGA160
|
plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm |
--- (JEITA) --- (JEDEC) --- (IEC)
|
2005-07-13 |
Footprints for mounting SOT802-2 package
Reflow soldering [pdf file]
|