| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026 (JEDEC); | 2006-06-20 |
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SOT841-4
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Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design