NXP Semiconductors


Select site:

English

SOT855-2

SOT855-2 - plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT855-2
HTQFP64plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad- - - (JEDEC); 2009-05-26

Related documents

Handling precautions
IC26_CHAPTER_3
Mounting and soldering
AN10365
Thermal design
IC26_CHAPTER_6

Products in this package