| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm | MO-220 (JEDEC); | 2009-02-05 |
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SOT865-3
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Related documents
- Handling precautions
- Mounting and soldering
- Reflow soldering
- Thermal design