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SOT926-1; plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm

+ Back to Package Main + General description + Outline drawing + Soldering information
+ Handling precautions + Thermal design        

General description

On this page you can find the package outline drawing and soldering information of this package.

Outline drawing of package SOT926-1

Package Version Package Name Package Description Reference codes Issue date
SOT926-1 TFBGA100   plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm --- (JEITA) --- (JEDEC) --- (IEC)   2005-12-22

Footprints for mounting SOT926-1 package

Reflow soldering [pdf file]