OL-IP3053CX20

Wafer level chip-size package; 20 bumps (8-4-8)


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Package versionPackage namePackage descriptionReference codesIssue date
OL-IP3053CX20WLCSPWafer level chip-size package; 20 bumps (8-4-8)2011-06-06

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP3053CX20Integrated 2, 4, 6 and 8-channel passive EMI-filter network with high-level ESD protection to IEC 61000-4-2 level 4

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