
OL-IP3053CX5
Wafer level chip-size package; 5 bumps (2-1-2)
| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| OL-IP3053CX5 | WLCSP | Wafer level chip-size package; 5 bumps (2-1-2) | 2011-06-06 |
| Type number | Description | Quick access |
|---|---|---|
| IP3053CX5 | Integrated 2, 4, 6 and 8-channel passive EMI-filter network with high-level ESD protection to IEC 61000-4-2 level 4 |
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